CAS RN.:102-60-3
EINECS: 203-041-4
Molecular Weight:294.4297
Molecular Formula:C14H34N2O4
Boiling Point(℃):369.1°C at 760 mmHg
Flash Point(℃):145.7°C
Water Solubility:miscible
Application
Q75 is used as metal complexing agent, used as scaling powder and cleaner in electroless copper PCB plating.
Specification
Appearance Clear colorless viscous liquidAPHA(≤) 50
MgKOH/g 750~770
Pa.s,25℃ 24000~26000
PH 9.0~12.0
Moisture content(≤) 0.1%
Packing
25kg/drum